(25 - 26 October, 2016)
Workshops on DAY 1
Workshops on DAY 2
Oct. 25, 2016
09:40 - 10:40
The Direction of Telemetry Transmitters in a Changing Ambiance

Presenter: Mr. Philip H. Tannenholz (President, ENCORE ASSOCIATES)

Emhiser Research Inc of Verdi, Nevada, USA is the foremost provider of telemetry transmitters to both the civilian and military markets of the USA and other friendly countries throughout the world. As the world of telemetry continues to evolve, Emhiser engineering continues the development of new transmitters to meet the growing and changing requirements for both air and ground vehicles of every type.

In this workshop, we will discuss a new technique being applied to a new transmitter which provides the capability for dual video, both analog and digital, while also transmitting a standard telemetry stream simultaneously with the video. While this new transmitter is at C-band, the technique can be used for other frequency bands.
10:50 - 12:10
Up to 3X Faster and 50% Cut Costs
DO-178C Certification!
On Successful A&D Programs DO-178C Certification using DO-331 Model-Based Development and DO-330 Qualifiable Engineering Software Tools

Presenters: Mr. Pierre VINCENT , Safety & Certification Expert
Mr. Jair GONZALEZ , Technical Director
Mr. Amar BOUALI , VP Sales South-Europe, Turkey, MEA

We will first share the actual results on selected on-going A&D programs that have successfully passed DO-178C certification audits applying with DO-331 Model-Based approach and using the Ansys SCADE DO-330 qualifiable tools.

The selected programs are:
  • FADEC for wide-body aircraft engines: DAL-A, FAA certification;
  • Cockpit Display System for Utility Helicopter: DAL-A, US Army SED;
  • Fuel Management for a single-aisle aircraft: DAL-A, EASA.

We will then explain how these programs have setup their model-based workflow with Ansys SCADE and achieved significant SW development and certification acceleration factor, up to 3 times, cutting their overall cost by 50%.

We will end by illustrating the introduced concepts through a tool demonstration.

13:40 - 15:00
Multipath Analysis in a Monopulse Radar System

Presenter : Mr. Mehmet KARAERIK (Senior RF Systems Engineer, METEKSAN)

This study points out the disrupting effects of multipath propogation in a monopulse system.

When the target is approaching or becoming distant from the radar system in a low angled manner towards the perpendicular plane to the boresight of the antenna, multipath effect disrupts the incoming received signal both in amplitude and phase, as the monopulse radar system antenna consists more than one sub-antennas placed spatially which separates the analysis from a point source/receiver.  We study the multipath basics which is affecting the point source prior to the expanded analysis of the effects on a monopulse antenna system.  Usage of the analysis will be discoursed  in a well defined methodology to improve or eliminate the disrupting effects in the radar system.

15:30 - 17:00
Flex-Rigid Circuit Board Techniques
for High-Tech Applications

Presenter: Mr. Markus Wille , R&D Manager, Schoeller Electronics Systems GmbH

Modern electronic systems possess very high functionality and at the same time they are very compact in the design and type of construction. The amount of space that device designers make available for the electronic equipment is always limited and therefore needs to be utilized in the best possible way.

The electronic components have an increasingly higher density and larger number of connections.
For those reasons, circuit boards need to have a high interconnection density, must be very reliable and should utilize the available space in an optimum degree. Flexible circuit boards are one possibility, but the most reliable technology is offered by the flex-rigid circuit board.

This paper will give an introduction into the techniques of flex-rigid circuit boards. Various build-up construction techniques will be presented and typical applications will be shown.

The paper will present the latest state-of-the-art designs with ultra-thin substrates that fit into smart electronic devices for high-tech applications e. g. in medical devices or in industrial electronics.

Oct. 26, 2016
10:50 - 12:10
How Can Model-Based System Engineering Bring Benefits to Avionics System Engineering?

Presenters: Mr. Pierre VINCENT , Safety & Certification Expert
Mr. Jair GONZALEZ , Technical Director
Mr. Amar BOUALI , VP Sales South-Europe, Turkey, MEA

We will explain how Model-Based System Engineering (MBSE) greatly helps avionics system design in tacking the challenging complex activities, such as:
  • Management of complexity (data management & navigation, engineering team concerns, integration, update, etc.)
  • Functional decomposition, architectures, and operational mappings
  • Hardware and software redundancies to manage safety considerations
  • Communication protocols
  • Complex hardware network with configuration switches
  • Resource sharing principle (CPU, network, …)

We present SCADE System tools and methodology as a way to handle these critical challenges while taking care of ensuring key properties such as interoperability (SysML founded framework), usability with a fully System Engineering oriented HMI, scalability in its ability to handle thousands of data, compliance with ARP-4754A, customizable with extensible description language for diverse avionics concepts (ARINC 429, ARINC 664-P7, CAN, etc.).

A complete demonstration on an industrial case will illustrate all the concepts and capabilities highlighting the obtained benefits.

13:10 - 14:30
Achieving DO-178C Compliance
with the LDRA tool suite®

Presenter: Mr. Mark Richardson (Field Application Engineer, LDRA)

This workshop will show the following:
  • How Requirements (System Level, High Level and Low Level) can be imported from various different sources such as DOORS, Word, Excel
  • How the mapping can be performed from the source code to the Low Level Requirements
  • How the traceability can be viewed between the Requirements and the source code
  • How High Level and Low Level Test Cases can be imported and mapped to the High Level and Low Level Requirements
  • How the source code can be verified against a coding standard such as MISRA C:2012/AMD1
  • How the quality of the source code can be verified; ensuring that the code is clear, maintainable and testable
  • How High Level Test Cases can be run on the code and verified; and how the Structural Coverage and Dynamic Data Coupling coverage can be measured after running all the High Level Test Cases
  • How to view the missing Structural Coverage ensuring that there is no Extraneous or Dead code
  • How the Low Level Test Cases can be run to verify all the Low Level Requirements and to complement any missing Structural Coverage
  • How to trace the Objectives from the DO-178C standard